Apparatus for simultaneous roll-to-roll wet processing of two workpieces disposed within a single chamber

ABSTRACT

A system is described to deposit a buffer layer onto exposed surfaces of two different solar cell absorber layers of two different flexible workpieces from a process solution including all chemical components of the buffer layer material. The buffer layer is deposited from the process or deposition solution while the flexible workpieces are simultaneously heated and processed within a chamber in a face to face manner as the process solution is flown through a process gap formed between the exposed surfaces of the two solar cell absorber layers.

This application is a continuation of U.S. application Ser. No.12/464,673 filed May 12, 2009 entitled “ROLL-TO-ROLL PROCESSING METHODAND TOOLS FOR ELECTROLESS DEPOSITION OF THIN LAYERS”; this applicationis also a continuation in part of U.S. application Ser. No. 11/735,430,filed Apr. 13, 2007 entitled “METHOD AND APPARATUS TO FORM THIN LAYERSOF MATERIALS ON A BASE,” which claims priority to U.S. ProvisionalApplication Ser. No. 60/744,827, filed Apr. 13, 2006; and thisapplication is a continuation in part of U.S. application Ser. No.12/037,076 filed Feb. 25, 2008 entitled “METHOD AND APPARATUS FORCONTINUOUS PROCESSING OF BUFFER LAYERS FOR GROUP IBIIIA VIA SOLARCELLS”, which claims priority to U.S. Provisional Application Ser. No.60/891,443, filed Feb. 23, 2007, which applications are expresslyincorporated by reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Inventions

The present inventions relate to apparatus for fabricating thin filmsolar cells employing a chemical bath deposited (CBD) buffer layer. Morespecifically the present inventions describe apparatus for continuousmanufacturing of Group IBIIIA VIA solar cells in a roll-to-roll fashion.

2. Description of the Related Art

Solar cells are photovoltaic (PV) devices that convert sunlight directlyinto electrical power. The most common solar cell material is silicon,which is in the form of single or polycrystalline wafers. However, thecost of electricity generated using silicon-based solar cells is higherthan the cost of electricity generated by the more traditional methods.Therefore, since early 1970's there has been an effort to reduce cost ofsolar cells for terrestrial use. One way of reducing the cost of solarcells is to develop low-cost thin film growth techniques that candeposit solar-cell-quality absorber materials on large area substratesand to fabricate these devices using high-throughput, low-cost methods.

Group IBIIIA VIA compound semiconductors comprising some of the Group IB(Cu, Ag, Au), Group IIIA (B, Al, Ga, In, Tl) and Group VIA (O, S, Se,Te, Po) materials or elements of the periodic table are excellentabsorber materials for thin film solar cell structures. Especially,compounds of Cu, In, Ga, Se and S which are generally referred to asCIGS(S), or Cu(In,Ga)(S,Se)₂ or CuIn_(1-x) Ga, (S_(y)Se_(1-y)) k, where0≦x≦1, 0≦y≦1 and k is approximately 2, have already been employed insolar cell structures that yielded conversion efficiencies approaching20%. Absorbers containing Group IIIA element Al and/or Group VIA elementTe also showed promise. Therefore, in summary, compounds containing: i)Cu from Group IB, ii) at least one of In, Ga, and Al from Group IIIA,and iii) at least one of S, Se, and Te from Group VIA, are of greatinterest for solar cell applications. It should be noted that althoughthe chemical formula for the absorbers is often written asCu(In,Ga)(S,Se)₂, a more accurate formula for the compound isCu(In,Ga)(S,Se) k, where k is typically close to 2 but may not beexactly 2. For simplicity we will, occasionally, continue to use thevalue of k as 2. It should be further noted that the notation “Cu(X,Y)”in the chemical formula means all chemical compositions of X and Y from(X=0% and Y=100%) to (X=100% and Y=0%). For example, Cu(In,Ga) means allcompositions from CuIn to CuGa. Similarly, Cu(In,Ga)(S,Se)₂ means thewhole family of compounds with Ga/(Ga+In) molar ratio varying from 0 to1, and Se/(Se+S) molar ratio varying from 0 to 1.

The structure of a conventional Group IBIIIA VIA compound photovoltaiccell such as a Cu(In,Ga,Al)(S,Se,Te)₂ thin film solar cell is shown inFIG. 1. The device 10 is fabricated on a substrate 11, such as a sheetof glass, a sheet of metal (such as aluminum or stainless steel), aninsulating foil or web, or a conductive foil or web. The absorber film12, which includes a material in the family of Cu(In,Ga,Al)(S,Se,Te)₂,is grown over a conductive layer 13, which is previously deposited onthe substrate 11 and which acts as the electrical contact to the device.The structure including the substrate 11 and the conductive layer 13 orthe contact layer, is often called a base 16. Various conductive layerscomprising Mo, Ta, W, Ti, and nitrides of these materials etc. have beenused in the solar cell structure of FIG. 1. If the substrate itself is aproperly selected conductive material, it is possible not to use aconductive layer 13, since the substrate 11 may then be used as theohmic contact to the device. After the absorber film 12 is grown, atransparent layer 14 such as a CdS, ZnO or CdS/ZnO stack is formed onthe absorber film. Radiation 15 enters the device through thetransparent layer 14. Metallic grids (not shown) may also be depositedover the transparent layer 14 to reduce the effective series resistanceof the device. It should be noted that the structure of FIG. 1 may alsobe inverted if substrate is transparent. In that case light enters thedevice from the substrate side of the solar cell.

In a thin film solar cell employing a Group IBIIIA VIA compoundabsorber, the transparent layer 14 often comprises a stack structurecomprising a buffer layer 17 and a transparent conductive layer 18 asshown in the inset of FIG. 1, which is a cross-sectional view of aportion 19 of the transparent layer 14. The transparent layer 14, itselfmay comprise a stack such as an undoped-ZnO/doped-ZnO stack, anundoped-ZnO/In—Sn—O (ITO) stack etc. In manufacturing the cell, thebuffer layer 17 is first deposited on the Group IBIIIA VIA absorber film12 to form an active junction. Then the transparent conductive layer 18is deposited over the buffer layer 17 to provide the needed lateralconductivity.

Various buffer layers with various chemical compositions have beenevaluated in solar cell structures. CdS, ZnS, Zn—S—OH, Zn—S—O—OH, ZnO,Zn—Mg—O, Cd—Zn—S, ZnSe, In—Se, In—Ga—Se, In—S, In—Ga—S, In—O—OH, In—S—O,In—S—OH, etc. are some of the buffer layer materials that have beenreported in the literature. Buffer layers for Group IBIIIA VIA devicessuch as CIGS(S) solar cells are typically 5-200 nm thick and may bedeposited by various techniques such as evaporation, sputtering, atomiclayer deposition (ALD), electrodeposition and chemical bath deposition(CBD), etc.

Chemical bath deposition (CBD) is the most commonly used method for theformation of buffer layers on CIGS(S) absorber films. The techniqueinvolves preparation of a chemical bath comprising the chemicalingredients of the buffer layer to be formed. The temperature of thebath is raised to a typical range of 50-90° C. and the surface of theCIGS(S) film is exposed to the heated bath. Alternately, the substratecontaining the CIGS(S) film may be heated and then dipped into thechemical bath kept at a lower temperature as described in U.S. Pat. No.6,537,845. A thin buffer layer grows onto the CIGS(S) film as a resultof homogeneous chemical reactions initiating upon application of heat tothe bath and/or to the substrate carrying the CIGS(S) film.

An exemplary CBD process for the growth of a cadmium sulfide (CdS)buffer layer employs a chemical bath comprising cadmium (Cd) species(from a Cd salt source such as Cd-chloride, Cd-sulfate, Cd-acetate,etc.), sulfur (S) species (from a S source such as thiourea) and acomplexing agent (such as ammonia, triethanolamine (TEA), diethanolamine(DEA), ethylene diamine tetra-acetic acid (EDTA), etc) that regulatesthe reaction rate between the Cd and S species. Once the temperature ofsuch a bath is increased to the 50-90° C. range, the reaction betweenthe Cd and S species initiates homogeneously everywhere in the solution.As a result, a CdS layer forms on all surfaces wetted by the heatedsolution and CdS particles form homogeneously within the solution. Thereaction rate between Cd and S species is a function of temperature. Therate increases as the temperature is increased and it decreases as thetemperature is reduced.

The prior art CBD processes are batch processes. In other words, inthese prior-art methods a pre-measured amount of the bath or solution isused to form a buffer layer on a pre-selected surface area of astructure, such as a solar cell structure. After formation of the bufferlayer on the pre-selected surface area of the structure, the used bathis discarded along with the particles formed within the bath. As can beappreciated from this brief review, such prior-art approaches generatelarge amounts of chemical waste and increase cost since actual materialsutilization to form the buffer layer on the surface of the structure isvery low, typically lower than 20%. Most of the buffer layer material iswasted on forming a film on the walls of the reactor holding the CBDsolution, and on forming particles of the buffer layer material withinthe solution. The present invention increases materials utilization ofthe CBD processes, reduces waste, and allows continuous deposition ofmaterials on substrates which may be in the form of rolled foils.

SUMMARY

The present inventions are related apparatus for fabricating thin filmsolar cells employing a chemical bath deposited buffer layer.

In one aspect the, present invention is directed to a system to deposita CdS buffer layer onto surfaces of two different solar cell absorberlayers of two different flexible workpieces from a process solutionincluding all chemical components of the CdS buffer layer material. CdSis deposited from the deposition solution while the flexible workpiecesare simultaneously heated and processed within a chamber.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a solar cell employing a GroupIBIIIA VIA absorber layer;

FIG. 2 shows an exemplary buffer layer deposition system;

FIG. 2A shows a deposition section employing a heater as well as acooler;

FIG. 3 shows a roll-to-roll deposition system to coat a buffer layer ona flexible structure;

FIG. 4A shows a side view of a deposition chamber with shaped heatedwall;

FIG. 4B is a cross-sectional view of the chamber of FIG. 4A taken acrossthe plane K-K;

FIG. 4C is a cross sectional view taken at the start of the shaping zoneof the chamber of FIG. 4A;

FIG. 5A shows a side view of an exemplary deposition chamber that coatsa buffer layer on two flexible workpieces simultaneously;

FIG. 5B is a cross-sectional front view of the chamber of FIG. 5A takenacross the plane U-U;

FIG. 5C is a cross-sectional front view of the chamber of FIG. 5A takenacross the plane U-U that shows an embodiment in which seals move withthe workpieces through the gap of the chamber;

FIG. 6 is a side view of an embodiment of a deposition system with asupport plate loop including a plurality of linked support platesections;

FIG. 7A is a schematic top view of a support plate section shown in FIG.6; and

FIG. 7B is a cross sectional view of the support plate section takenalong the line 7B-7B.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In one embodiment, the CBD solution is heated when the solution is incontact with the surface to be coated and then the solution is cooleddown when it is not in contact with the surface to be coated. The cooledsolution may then be re-circulated again over the surface to be coated.This way film formation reaction is accelerated on the surface to becoated and homogeneous nucleation within the solution and on surfacesother than the surface to be coated is minimized and materialsutilization is improved.

In another embodiment, substantially all surfaces of the reactor wallsare covered with the substrates to be coated and therefore depositionand waste of material on reactor walls is eliminated or reduced in thezone where heat is applied to the solution. Yet in an additionalembodiment the solution is continually monitored with a monitoring unitin terms of its chemical composition and filtered. If necessary, speciesare dosed into the solution to keep its chemical compositionsubstantially the same during long periods of time which may be severalhours. This way, waste is minimized, materials utilization is furtherenhanced and continuous deposition of materials on large number ofsubstrates or long sheets of flexible substrates may be achieved.Various aspects of the present invention will now be described using, asan example, CdS buffer layer deposition on a CIGS(S) absorber surfaceemploying a specific chemistry. It should be noted that various otherchemistries may be employed in the present invention to deposit variousother buffer layer materials listed before.

An exemplary aqueous CdS deposition bath may be formed by mixing inwater 1-50 ml of 1M cadmium salt solution, such as Cd-chloride,Cd-sulfate, Cd-acetate, or the like, 1-50 ml of 14.53 M ammoniumhydroxide solution as complexing agent, and 1-50 ml of 1M thiourea as Ssolution. Another complexing agent solution such as 0.5M Triethanolamine(TEA) may also be added in an amount that is in the range of 1-20 ml. Atypical bath may contain (by volume) 5-15% cadmium solution, 5-15%complexing agent (ammonium hydroxide), 5-15% S solution (thiourea) andoptionally 5-10% of the additional complexing agent solution (TEA), thebalance being the solvent, i.e. water.

The typical CBD electrolytes or solutions are quite stable at lowtemperatures. Homogeneous reactions within such solutions initiate oncethe temperature is raised, for example, to over 50° C. A bath may bestable for over 5 hours at 20° C., whereas large particles may formwithin minutes in a bath that is heated up to 80° C. The above mentionedCdS bath acts in a similar fashion. Since the solution is mostly kept atlow temperature for the method of the present invention, it is possibleto mix all the ingredients of the solution. In prior art techniques itis customary to mix the Cd source and the complexing agent in thesolvent, then heat up the solution to 50° C. or higher, and then add theS source, at which time reaction and CdS formation starts.

FIG. 2 is a sketch of a CdS deposition system 20 that may be used todeposit a CdS buffer layer on a surface such as on a CIGS(S) absorberfilm surface. The CdS deposition system 20 comprises a depositionsection 21, a solution container 22, a feed line 23 that carries thesolution from the solution container 22 to the deposition section 21 anda return line 24 that carries the solution from the deposition section21 back to the solution container 22. There may be additional componentsadded to the system 20 of FIG. 2 such as filters 25A on the return line24, filters (not shown) on the feed line 23, filters 25B on a secondaryloop 26 that may circulate the solution within the solution container 22for the purpose of particle elimination, cooling, mixing etc. There ispreferably a cooling loop 27 with a cooling coil 27A within the solutioncontainer 22. A cooling liquid may be circulated through the coolingcoil 27A to lower the temperature of the bath within the solutioncontainer 22. The temperature of the solution within the solutioncontainer 22 may be in the range of 5-40° C., preferably in the 15-20°C. range. There is preferably a heater 29 provided to apply heat to aworkpiece or structure 28, the exposed surface 28A of which will becoated with CdS. The heater 29 may be a resistance heater, a hot liquidjacket, an infrared lamp heater etc. that is configured to heat up thestructure 28 to a process temperature, which may be in the range of50-90° C. It should be noted that another structure (not shown) andanother heater (not shown) may be placed across from the structure 28 sothat two such structures are processed face-to-face, at the same time.This way, no CdS deposition is allowed on the exposed wall 21A of thedeposition section 21. Yet another design is shown in FIG. 2A. In thiscase a cooler 29A is provided for the exposed wall 21A of the depositionsection 21. This way reaction and deposition of CdS on the exposed wall21A is greatly reduced or even eliminated. In effect the depositionsection 21 becomes a cold-wall reactor where only the wall carrying thestructure to be coated with CdS is heated. Other walls are cooled downto keep them clean of CdS deposit.

The apparatus design and the process approach described with respect toFIGS. 2 and 2A heat the solution when it is in contact with the exposedsurface 28A of the structure 28. The temperature of the solutioncontacting the exposed surface 28A may be in the range of 50-90 C.,preferably in the range of 55-80° C. The temperature of the solution inthe solution container 22, on the other hand may be in the range of15-20° C. As described before, the solution in the solution container 22may be cooled down to this temperature range using the secondary loop 26and/or the cooling loop 27. Alternately, there may be cooler integratedwith the return line 24. In this case as the heated solution exits thedeposition section 21 and passes through the return line 24 it getscooled down on its way to the solution container 22. Such an approach isattractive since it cools down the walls of the tubes or other fluidcarrier containing the heated solution from the deposition section 21,therefore, reduces or eliminates CdS deposition on such walls.

It should be noted that the preferred method of depositing the CdS layeron the exposed surface 28A (which may be an exposed surface of a CIGS(S)absorber film) of the structure 28 (which may be a substrate/contactlayer/CIGS(S) structure) involves direct heating of the structure 28 andthus heating a micro-layer of solution touching the exposed surface 28A.This way, CdS powder formation in the bulk of the solution may bereduced or avoided and deposition primarily takes place on the exposedsurface 28A. Such an approach yields very high materials utilizationwhich may be close to 100%. Cooling the solution and re-cycling over thestructure is attractive since it allows filtering of formed particles,better uniformity due to controlled liquid flow over the substrate andless chemical waste.

Another method employs heater (not shown) on the feed line 23 so thatthe solution may be heated to a pre-determined process temperature valuebefore entering the deposition section 21. In this case the heater 29may or may not be utilized to further heat the structure 28. Similar tothe method discussed before, upon exiting the deposition section 21 thesolution may be cooled down to a temperature which is lower than theprocess temperature to reduce powder formation and deposition on thewalls of the system. Such temperature lowering may be done within thereturn line 24 and/or within the solution container 22.

The concepts discussed above have the following unique features thatresolve some of the problems associated with prior-art techniques; i)the deposition bath or solution is heated to a process temperature,which may be in the range of 50-90° C., right before it wets the surfaceto be coated with CdS or during the period when it wets the surface tobe coated with CdS, ii) the solution is cooled down to a temperaturelower than the process temperature after it is used to coat the surfacewith CdS, iii) the steps of i) and ii) are repeated either fordepositing thicker CdS on the same surface or for depositing CdS onsurfaces of new structures introduced into the deposition section in acyclic or continuous manner. The preferred method involves continuousrecycling of the solution between the solution container 22 and thedeposition section 21, although intermittent flow of the solutionbetween the deposition section 21 and the solution container 22 may alsobe utilized. Once the solution is in the solution container 22 it may beanalyzed for its composition and ingredients that may be reduced due toreactions may be added to the solution. Such ingredients include but arenot limited to water, ammonia, Cd salt, S source, complexing agent etc.By controlling the solution composition this way, the same solution maybe used for coating a large number of structures with CdS withoutreplacing the base solution. This reduces waste and thus cost of theprocess. The base solution may be occasionally replaced with a fresh oneif its impurity content increases to a level that may affect the qualityof the deposited CdS film. Removal of particles from the solution may beachieved through filtration using various approaches includingcentrifuging the solution. The CdS particles thus removed may bere-cycled later to form a Cd source for the process.

It should be noted that the methods and apparatus of the presentinventions are well suited for continuous processing such asroll-to-roll processing. Unlike the batch process approach of prior-artmethods that uses a given volume of the solution to deposit CdS on astructure with a pre-selected size and discards the used solution, thepresent method re-cycles and controls the chemical composition of thesolution. Thus various portions of a given structure such as a long(e.g. 1000 ft) foil substrate gets exposed to a repeatable processenvironment (such as a repeatable solution chemistry and repeatableprocess temperature), as they are moved through a deposition section,typically at a rate of 100 cm/minute-1000 cm/minute. FIG. 3schematically shows a roll-to-roll deposition system to coat a bufferlayer on a flexible structure 34 that is moved from a supply spool 35 toa take-up spool 36 through a deposition section 21. The CBD solution iscirculated between a solution container 22 and the deposition section 21through a feed line 23 and a return line 24 as described before. Thespeed of the flexible structure 34 is adjusted to adjust the residencetime of a portion of the flexible structure 34 in the deposition section21. This residence time, along with the temperature and flow rate of thesolution, determines the thickness of the buffer layer deposited on thatportion of the flexible structure. A typical flow rate of the solution,both into and out of the deposition section 21, is in the range of 0.1liter/minute to 10 liters/minute.

For roll to roll processing of continuous flexible workpieces, it ispreferable to deposit the buffer layer on a front surface of thecontinuous flexible workpiece by flowing the solution over the frontsurface while keeping a back surface of the continuous flexibleworkpiece dry. This may be achieved by shaping the continuous flexibleworkpiece using a pulling force or an attractive force generatedemploying a mechanism such as a vacuum or magnets, as will be describednext.

FIG. 4A shows a side cross-sectional view of an exemplary roll-to-rollsystem with a process section 21A where a buffer layer such as a CdSlayer is deposited on a front surface 34A of a continuous flexibleworkpiece 34 or flexible workpiece hereinbelow.

FIG. 4B shows a cross-sectional view of the process section 21A takenacross the line K-K. The process section 21A includes a heated shapingwall 40 or heated shaping plate to elastically shape the flexibleworkpiece 34 during the deposition process to retain the depositionsolution on the front surface 34A of the flexible workpiece 34. As shownin FIG. 4B in this embodiment, a cavity area 62 of the heated shapingwall 40 curves the two long edges of the flexible workpiece upwardly andform a cavity region 64 therebetween to retain a process solution 41that is dispensed onto its exposed front surface 34A. The bottom of thecavity region 64 is substantially flat for uniform flow of a processsolution over it.

During the process, the flexible workpiece 34, which is a flat sheet, isunwound from a supply spool 35 and enters the process section 21A whereits back surface 34B is pulled towards the cavity area 62 of the heatedshaping wall 40 to bend the long edges of the flexible workpiece 34upward, thereby forming the workpiece itself into a curved shape oru-shaped configuration with a flat bottom, and thus creating a channelthrough which the process solution 41 can flow. It is understood thatthe shaping of the workpiece is elastic in nature so that as soon as thepulling force is removed, the workpiece recovers back to its originalflat shape. Pulling of the back surface 34B of the flexible workpiece 34against the top surface 44A of the heated shaping wall 40 may beachieved by pulling a vacuum through vacuum through-holes 47 or byproviding magnets (not shown) which may be placed into the heatedshaping wall 40 or mounted below the bottom surface 44B of the heatedshaping wall 40. Alternately, the top surface 44A of the heated shapingwall 40 may comprise magnets or magnetic properties. Magnets would beeffective only for flexible workpieces comprising a magnetic substratesuch as a magnetic steel substrate. A vacuum, on the other hand may beused for all types of flexible workpieces, magnetic or non-magnetic. Itshould be noted that although the bottom surface 44B of the heatedshaping wall 40 is shown to be curved at the edges, it can be flat orany other shape. The top surface 44A of the heated shaping wall 44,however, is shaped so that it is raised at the two long edges as shownin FIG. 4B, thereby forming a u-shaped channel. This way when theprocess solution 41 is fed onto the front surface 34A of the flexibleworkpiece 34, which may comprise, for example, an exposed surface of anabsorber layer, the solution 41 flows only within the channel formed bythe front surface 34A without wetting the back surface 34B of theflexible workpiece 34. It should be noted that an edge region of theflexible workpiece 34 would not be wetted by the process solution 41 andtherefore would not be coated with the buffer layer. This edge exclusionregion may be 2-10 mm wide along both of the edges of the flexibleworkpiece 34 and cannot be used for device fabrication.

The buffer layer is deposited from the process solution 41 onto theportion of the front surface 34A of the flexible workpiece 34 wetted bythe solution. The height of the process solution 41 flowing over thefront surface 34A may be in the range of 0.5-5 mm, preferably in therange of 1-3 mm, and the flow rate may be determined by the inclinationangle with respect to the horizontal plane. The inclination angle may bein the range of 5-15 degrees. The amount of bend at the two long edgesof the flexible workpiece 34 may be in the range of 2-10 mm, preferablyin the range of 3-6 mm so that the process solution 41 is contained overthe front surface 34A of the flexible workpiece 34 without spilling overto the back surface 34B of the workpiece 34. After the deposition, theworkpiece is moved away from the heated shaping wall 40 and it graduallybecomes flat again as the used solution flows out of the front surface34A. The used solution 42 may then be collected in a container 43 whereit can be treated, refurbished or discarded. The processed flexibleworkpiece may then be cleaned dried and wound onto a take-up spool orreceiving spool (not shown).

The process section 21A may further comprise a transition wall 48 thatextends between locations labeled as “X” and “Y” in FIG. 4A. Thetransition wall 48 comprises a support plate 40A. The shape of a topsurface 45A of the support plate 40A changes from “flat” at location “X”into the “cavity” (similar to the shape of the cavity area 62 of theheated shaping wall 44) at location “Y” to facilitate the shaping of theworkpiece into the shape of the cavity from its previous flat state. Thecavity section of the support plate may be seen as a portion of thecavity area 62 of heated shaping wall extended into the transition wall48. FIG. 4C shows the flat shape of the support plate 40A at location“X” where the back surface 34B of the flexible workpiece 34 is firstpulled against the top surface 45A of the support plate 40A using avacuum or magnets as explained before. By first registering a portion ofthe flexible workpiece 34 onto a flat section of the support plate 40Aand then sliding the portion towards and through a cavity sectiongradually, helps shape the portion of the workpiece without damage bythe time it makes contact with the heated shaping wall 40. The heatedshaping wall 40 and the transition wall 48 may be connected as twoseparate pieces or manufactured as a single piece.

In another embodiment a support belt comprises a number of support platesections that hold and shape the flexible workpiece and travel with itwithin the process section. In this case when the back surface of theflexible workpiece is held by and in physical contact with a supportplate section, there is no relative motion between the flexibleworkpiece and the support plate section.

FIG. 6 shows in side view a deposition system 90 including a supportbelt 100 and a heating mechanism 104 which may include a heating medium105 to heat the support belt 100. A deposition solution 101 is flowed ona top surface 109A of the flexible workpiece through a solutiondispenser 103. The heating medium 105 may be heated liquid, such aswater. Alternately lights or other heating mechanism may be employed.The support belt 100 is shaped as an endless loop by movably linkingsupport plate sections 102 to one another as in the manner shown in FIG.6. Top surface 108A of each support plate section 102 faces outside thesupport belt 100 to support a continuous workpiece 109, which may bepreferably inclined with respect to the horizontal plane, while the backsurface 108B of each support plate section 102 faces the inside of thesupport belt 100. Width ‘W’ of each support plate section may be in therange of 10-50 millimeters. As shown in FIGS. 7A and 7B, the top surface108A of each support plate section 102 has a substantially rectangularshape, and includes a cavity area 110 to shape the continuous workpiece109 shown in FIG. 6. The length of each support plate section 102 may beequal to, a bit smaller than or a bit larger than the width of theflexible workpiece 109 depending on the depth of the cavity area 110.

The continuous workpiece 109 may be attracted towards the cavity area110 using, for example, magnets 112 or electromagnets, which may beplaced within the support plate sections 102. Alternately, magnets orelectromagnets may be placed over the back surface 108B of the supportplate sections 102. The support belt 100 may be placed around rollers106A and 106B. The rollers 106A and 106B may be driven or idle rollers.As shown in FIG. 6, a group of the support plate sections 102 of thesupport belt 100 contact a back surface of the flexible workpiece 104when they are in a first position 114A or an upper position, whileanother group of the support plate sections in a second position 114B orlower position are heated in the heating mechanism 104. Top surfaces108A of the support plate sections 102 in the first position arecoplanar and follow a linear path. The support plate sections 102 in thesecond position 114B may or may not follow a linear path. When thesupport plate sections 102 of the support belt 100 are in the secondposition, they are heated by the heating medium, for example hot waterto a temperature which may be in the range of 50-100° C. When heatedsections are moved into the first position 114A they come into contactwith the back surface 109B of the workpiece 109 and heat, and at thesame time shape that portion of the workpiece as described above so thatdeposition takes place on the front surface of the flexible workpiece109 while the deposition solution is contained on the front surface bythe shape.

As discussed with reference to FIG. 2, in one embodiment two structuresmay be processed in a face-to-face manner. This way, no CdS depositionis allowed on the exposed wall 21A of the deposition section 21 in FIG.2 and all the deposits are performed on the two face-to-face exposedsurfaces of the absorber layers as desired, without much waste. FIG. 5Ashows a side view of an exemplary system with a deposition section 58 orchamber that deposits a buffer layer by the chemical bath or electrolessmethod on the exposed surfaces of two absorber layers, simultaneously,the two absorber layers having been formed on two flexible workpieces. Afirst flexible workpiece 52 and a second flexible workpiece 53 are fedinto the chamber 58 from two different supply spools (not shown). A backsurface 52B of the first flexible workpiece 52 is supported by a surfaceof a first heated wall 50, whereas a back surface 53B of the secondflexible workpiece 53 is supported by a surface of a second heated wall51, which is in proximity of and across from the first heated wall 50,separated by a gap. As explained above, vacuum suction or magneticforces may be used to keep the two workpieces engaged against thesurfaces of the two heated walls. A front surface 52A of the firstflexible workpiece 52 and a front surface 53A of the second flexibleworkpiece 53 face each other forming a process gap 55. A cross-sectionalview of the chamber 58 taken along the line U-U is shown in FIG. 5B.

As shown in FIG. 5B, the process gap 55 is defined by the front surface52A of the first flexible workpiece 52, the front surface 53A of thesecond flexible workpiece 53 and the two sealing members 57 near thelong edges of the flexible workpieces. During process, as the firstflexible workpiece 52 and the second flexible workpiece 53 are movedfrom two different supply spools (not shown) and through the chamber 58a process solution 54 is flown into the process gap 55. As the processsolution 54 flows through the process gap 55, it deposits the bufferlayer on the front surface 52A of the first flexible workpiece 52 andthe front surface 53A of the second flexible workpiece 53,simultaneously. As described before, both front surfaces may comprisesolar cell absorber layers and the buffer layer may be deposited ontothe two absorber layers. It should be noted that, in this embodiment,the total area of the workpiece front surfaces wetted by the processsolution is much larger, e.g. 1000 times or more, than the area of thesurfaces of the sealing members wetted by the process solution.Consequently, the buffer layer is basically deposited on surfaces whereit is needed. Very little amount gets wasted through deposition on thewetted surfaces of the sealing members 57. The used solution 56 flowsout of the chamber 58 and may be collected in a tank (not shown) asdescribed before.

It should be noted that the height of the process gap 55 may be in therange of 0.5-5 mm, preferably in the range of 1-3 mm, whereas the widthof the workpieces employed may be in the range of 0.3-2 m. For a 1 mmgap and 1 m wide workpiece, the ratio of the wetted workpiece totalfront surface area to the wetted sealing member total area is about 200cm/0.2 cm=1000. By minimizing the height of the process gap 57,maximizing the width of the flexible workpieces and minimizing the speedof the process solution flow, the utilization of materials in theprocess solution may be maximized and the waste may be minimized. Theangle of the heated walls against horizontal may be as high as 90degrees but it is preferably in the range of 5-20 degrees. This value ofthe angle may be varied to optimize the process results. Duringprocessing the heated walls of the system shown in FIGS. 5A and 5B arestationary and the flexible workpieces move. As for the sealing members57, they may be stationary or moving. In one embodiment as shown in FIG.5B, the sealing members 57 may be stationary and the first flexibleworkpiece 52 and the second flexible workpiece 53 may move with respectto the sealing members 57. In another embodiment as shown in FIG. 5C,the two sealing members 57 such as soft O-rings (shown as 57-1 an 57-2in FIG. 5C) made from elastic materials such as rubber, silicone etc.,may be continually fed into the gap between the first flexible workpiece52 and the second flexible workpiece 53 along the two long edges of thetwo workpieces, at a speed that is substantially equal to the linearspeed of the two flexible workpieces. In this case there would be norelative motion between the sealing members 57 and the two flexibleworkpieces during processing.

One special factor influencing the improved materials utilization of thepresent embodiment is the sealed nature of the process gap 55. Thecommonly used process solutions, such as solutions employed for CdSdeposition, comprise volatile species such as ammonium hydroxide. Suchvolatile species, while flowing over exposed large area surfaces,vaporize easily and leave the process solution. Once such species arelost from the process solution, the deposition rate of the buffer layerdrops drastically since ammonia is an important ingredient to controldeposition. In the design of FIGS. 5A and 5B, the process solution andits volatile species are trapped in the process gap 55, and thereforethe volatile species cannot vaporize and leave the solution until theused solution 56 emerges from the end of the chamber 58. As a result,the deposition rate of the buffer layer within the gap is maximizedwithout any loss of the volatile solution species. This increaseddeposition rate as well as processing two flexible workpiecessimultaneously, more than doubles the throughput of the present methodand the tool over other approaches. It should be noted that duringprocessing, the motion of the flexible workpieces may be in the samedirection as the flow of the process solution. Alternately, the flexibleworkpieces may be moved in a direction that is opposite to the directionof the process solution flow.

One other positive aspect of the face-to-face processing method andapparatus described above is the inherit uniformity of the processresults on two flexible workpieces. Since the process gap between thefront surfaces of the two flexible workpieces is small, when a processsolution is introduced into this process gap, the surface tension of thesolution distributes it over the two surfaces very uniformly. Theprocess gap is thus completely filled with the process solution providedenough solution is supplied into the gap. Since the process gap can bemade very uniform in height, the thickness of the process solution overthe front surfaces of the first and the second flexible workpieces isalways constant. This improves the uniformity of the deposited bufferlayers and the repeatability of the deposition process.

Although the present invention is described with respect to certainpreferred embodiments, modifications thereto will be apparent to thoseskilled in the art.

1. A system for depositing a buffer layer material from a liquid processsolution simultaneously onto an exposed surface of a first solar cellabsorber layer formed on a first workpiece and onto an exposed surfaceof a second solar cell absorber layer formed on a second workpiece,wherein the first workpiece and the second workpiece are continuousflexible workpieces, the system comprising: a chamber to deposit thebuffer layer material onto the exposed surfaces of the first and thesecond absorber layers when both the first and the second absorberlayers are simultaneously disposed therein in a face to faceconfiguration, the chamber comprising: a first heated wall that heatsthe first continuous flexible workpiece with the first solar cellabsorber layer formed thereon; a second heated wall placed substantiallyacross from the first heated wall, thereby forming a gap between thefirst heated wall and the second heated wall, such that both the firstcontinuous flexible workpiece and the second continuous flexibleworkpiece simultaneously fit within the gap so that the exposed surfaceof each of the first and second absorber layers face each other and havea process gap therebetween such that within the process gap the firstand second absorber layers do not contact each other, the process gapbeing narrower than a width of each of the first and second continuousflexible workpieces, wherein the second heated wall heats the secondcontinuous flexible workpiece with the second solar cell absorber layerformed thereon; a heating mechanism to heat the first and second heatedwalls, and thereby heat each of the first and second absorber layers toa temperature sufficient to cause deposition of the buffer layermaterial onto the exposed surface of each of the first and the secondabsorber layers from the liquid process solution disposed within theprocess gap; a workpiece inlet to receive the first and secondcontinuous flexible workpieces into the gap of the chamber; a workpieceoutlet to remove the first and second continuous flexible workpiecesfrom the gap of the chamber; a liquid solution inlet mechanism to flow,at a predetermined rate, the liquid process solution into the processgap and onto the exposed surfaces of the first and second absorberlayers, and cause contact of the liquid process solution simultaneouslywith the exposed surfaces of the first and second absorber layers; aliquid solution outlet to remove used liquid process solution from theprocess gap at a rate that substantially corresponds to thepredetermined rate that the liquid process solution enters the processgap; and a moving assembly to hold and simultaneously linearly move thefirst and second continuous flexible workpieces into the workpieceinlet, through the gap of the chamber, and out of the workpiece outlet,wherein the moving assembly comprises first and second feed spools tounwrap and feed unprocessed sections of the respective first and secondcontinuous flexible workpieces into the chamber and first and secondtake-up spools to receive the processed portions of the respective firstand second continuous flexible workpieces.
 2. The system of claim 1wherein the heating mechanism includes first and second heatersconfigured to heat the first and second heated walls, respectively, to afirst temperature that is higher than a temperature of the processsolution flowing into the process gap from the liquid solution inletmechanism.
 3. The system of claim 1 further including a sealing memberdisposed between the first continuous flexible workpiece and the secondcontinuous flexible workpiece when disposed in the chamber, wherein thesealing member is configured to substantially confine the liquid processsolution to the process gap.
 4. The system according to claim 3 whereinthe sealing member comprises at least two sealing member pieces, with atleast one sealing member piece disposed along each edge of the first andthe second continuous flexible workpieces so that volatile gases thatare formed from the liquid process solution are maintained substantiallywithin the process gap.
 5. The system according to claim 4 wherein theat least two sealing member pieces are stationary within the chamber. 6.The system according to claim 5 wherein the at least two sealing memberpieces are made from an elastic material.
 7. The system according toclaim 3 wherein the sealing member is configured to be moved within thechamber together with the first and the second continuous flexibleworkpieces.
 8. The system according to claim 7 wherein the sealingmember is made from an elastic material.
 9. The system according toclaim 3 wherein the at least two sealing member pieces are configured tobe moved within the chamber together with the first and the secondcontinuous flexible workpieces.
 10. The system according to claim 9wherein the at least two sealing member pieces are made from an elasticmaterial.
 11. The system according to claim 1 further including one of avacuum mechanism and a magnetic mechanism to support each of the firstand the second continuous flexible workpieces on the first and thesecond heated walls as each of the first and the second continuousflexible workpieces are moved by the moving assembly through thechamber.
 12. The system according to claim 5 further including one of avacuum mechanism and a magnetic mechanism to support each of the firstand the second continuous flexible workpieces on the first and thesecond heated walls as each of the first and the second continuousflexible workpieces are moved by the moving assembly through thechamber.
 13. The system according to claim 9 further including one of avacuum mechanism and a magnetic mechanism to support each of the firstand the second continuous flexible workpieces on the first and thesecond heated walls as each of the first and the second continuousflexible workpieces are moved by the moving assembly through thechamber.
 14. The system according to claim 1 wherein the moving assemblymoves each of the first and second continuous flexible workpiecesthrough the chamber at a rate between 100-1000 cm/minute.
 15. The systemaccording to claim 1 wherein the process gap is between 1-3 mm and eachof the first and second workpieces have a width that is the same and inthe range of 0.3-2 m.
 16. The system according to claim 3 wherein aratio of wetted workpiece total front surface area to wetted area ofsurfaces of the sealing members is at least 1000.